intel is hiring for 518 roles right now.
518 open roles · 629 postings · refreshed daily
Of the roles listed here, most are in US, Oregon, Hillsboro (41), US, Arizona, Phoenix (34), Malaysia, Penang (15), US, California, Santa Clara (14), India, Bangalore (10).
Search and filter intel roles on the board
Open roles at intel.
Showing 100 of 518 roles. See them all on the board.
Engineering Manager2
- Engineering Manager, Night Shift
US, Arizona, Phoenix
- Manufacturing Equipment Engineering Manager (Assembly)
Malaysia, Penang
Data Scientist1
- Finance Data Scientist
US, Arizona, Phoenix · US, California, Santa Clara · US, Oregon, Hillsboro
Hardware Engineer1
- EDA Tools Hardware Engineer
India, Bangalore · US, California, Santa Clara · US, Oregon, Hillsboro +2 more
Marketing Manager1
- Partner Marketing Manager
Virtual US
Operations Manager1
- Logistics Operations Manager (Transportation) (Contract)
Malaysia, Penang
Product Manager1
- Senior Ethernet Product Manager
US, Oregon, Hillsboro · US, California, Santa Clara · US, Arizona, Phoenix
Software Engineer1
- Software Engineering - PhD Intern
US, Oregon, Hillsboro
Solutions Architect1
- Senior AI Systems and Solutions Architect – Agentic AI and CPU Host
US, Oregon, Hillsboro · US, California, Folsom · US, California, Santa Clara +1 more
Other roles91
- Senior Manager, Branded Sponsorships
US, Oregon, Hillsboro · US, California, Folsom · US, California, Santa Clara +1 more
- Senior Materials Commodity Manager
US, Oregon, Hillsboro · US, Arizona, Phoenix
- Intel Foundry Principal Engineer Overlay Development Engineer - Lithography
US, Oregon, Hillsboro
- AI Solution Architect - Undergraduate Intern
US, Oregon, Hillsboro
- Data Science and Analytics - PhD Intern
US, Oregon, Hillsboro
- NMSI F11x Litho Tracks Engineer
US, New Mexico, Albuquerque
- Ocotillo Technology Fabrication Vacuum Systems Group (VSG) Module Engineer
US, Arizona, Phoenix
- Ocotillo Technology Fabrication Senior Lithography Reticle Engineer
US, Arizona, Phoenix
- Packaging Process Development Engineer
US, Arizona, Phoenix
- Defect Characterization Low Yield Analysis Engineer
US, Arizona, Phoenix
- Intern C++ Developer - Graphics Compute Driver (AI, HPC)
Poland, Gdansk
- GPU Software Performance Intern
Poland, Gdansk
- SoC Functional Validation Engineer – Core (CRE) Domain
Malaysia, Penang
- Graduate Talent (Software Application Development Engineer)
Malaysia, Penang · Malaysia, Kulim
- SoC Functional Validation Engineer - Functional Safety
Malaysia, Penang
- E-Core CPU Design Automation Engineer
Malaysia, Penang
- Graduate Talent (E-core CPU Physical Design)
Malaysia, Penang
- Construction Project Design Manager (Contract)
Malaysia, Kulim
- Supplier Management: Substrate Tier 2/3
Japan, Tokyo · Taiwan, Taipei · Taiwan, Hsinchu
- SoC Logic Design Engineer
India, Bangalore
- AI/ML Technologist
India, Bangalore
- GPU Software Development Engineer
India, Bangalore
- Finance Construction Settlement and Supply Chain Analyst - Americas
US, Arizona, Phoenix
- Yield Development Engineer
Malaysia, Penang · US, Arizona, Phoenix · US, Oregon, Hillsboro
- Module Engineering - PhD Intern
US, Oregon, Hillsboro
- Packaging Module Development Engineer
Malaysia, Kulim · US, Arizona, Phoenix · US, Oregon, Hillsboro
- E-Core (Atom) CPU Layout Design Engineer
Malaysia, Penang · Malaysia, Kulim
- Module Equipment Technician
Malaysia, Kulim · Malaysia, Penang · US, Arizona, Phoenix
- Analog Circuit Design Engineer
India, Bangalore
- (Epi) - Module Development Engineer - (PhD Intern)
US, Oregon, Hillsboro
- CPU Clock Design Engineer
US, Texas, Austin · US, Oregon, Hillsboro
- Senior Wet Etch Manufacturing Development Engineer
US, Oregon, Hillsboro · US, Arizona, Phoenix
- Product Failure Analysis Engineer - SCAN Design for Test
US, Oregon, Hillsboro
- Mixed Signal Design Verification Engineer
US, Oregon, Hillsboro · US, Texas, Austin
- HPC System Architecture
US, California, Santa Clara · US, Oregon, Hillsboro
- Silicon Packaging Design Architect
US, Arizona, Phoenix
- Senior Static Timing Analysis (STA) Engineer
US, Arizona, Phoenix · US, California, Santa Clara
- Sr Staff Substrate Yield Lead
US, Arizona, Phoenix
- Module Engineer On-Shift (MEOS) – Day Shift (7)
US, Arizona, Phoenix
- Analytical Chemistry Lab Technician
US, Arizona, Phoenix
- Project Analyst Student
Israel, Jerusalem
- Advanced Packaging Materials Sr. Commodity Manager
Japan, Tokyo · Malaysia, Penang
- Senior Verification Engineer
Ireland, Leixlip
- Formal Verification Engineer
India, Bangalore · Israel, Haifa · Israel, Jerusalem +1 more
- Mark Pack Label (MPL) Analyst
US, Oregon, Hillsboro · US, New Mexico, Albuquerque · US, California, Folsom +1 more
- Manufacturing Quality and Reliability Engineer
Malaysia, Kulim · Malaysia, Penang · US, New Mexico, Albuquerque
- Memory Circuit Design Engineer
US, Oregon, Hillsboro · US, California, Santa Clara · US, Texas, Austin +1 more
- Silicon Packaging Design Engineer
India, Bangalore · US, Arizona, Phoenix
- Finance Rebate Analyst
Costa Rica, San Jose
- Defect Metrology Engineer
Ireland, Leixlip · US, Arizona, Phoenix · US, Oregon, Hillsboro
- Staff Chemical Mechanical Planarization (CMP) Engineer
US, Oregon, Hillsboro · US, Arizona, Phoenix
- Staff EMIB-T Substrate Yield Engineer
US, Arizona, Phoenix · US, New Mexico, Albuquerque · US, Oregon, Hillsboro
- Module Engineering (PhD Intern)
US, Oregon, Hillsboro
- Sr AI Driver Architect - Neuromorphic Computing
US, California, Santa Clara · US, Oregon, Hillsboro
- AI Solution Architect - Graduate Intern
US, California, Santa Clara
- AI Solution Architect Graduate Intern
US, California, Santa Clara
- CPU Core Physical Design Technical Graduate Intern, Spring
US, California, Folsom
- Module Engineer On-Shift (MEOS) – Day Shift (5)
US, Arizona, Phoenix
- Module Engineer On-Shift (MEOS) – Night Shift (4)
US, Arizona, Phoenix
- Module Engineer On-Shift (MEOS) – Night Shift (6)
US, Arizona, Phoenix
- Manufacturing Failure Analysis Engineer
Malaysia, Penang
- Atom CPU Layout Design Engineer
Mexico, Guadalajara
- Package Design Electrical Engineer
Malaysia, Penang · Malaysia, Kulim
- Senior Hardware Design Engineer
Israel, Petah-Tikva
- Senior Signal Integrity Engineer (Hands-on)
Israel, Petah-Tikva
- Undergraduate Intern Technical (OpenVINO, Neural Network Compression Tools) (f/m/d)
Germany, Munich
- GPU Physical Design Engineer Intern
Costa Rica, San Jose
- Cloud Software Development Engineer
India, Bangalore · US, Arizona, Phoenix · US, Oregon, Hillsboro
- Technology Research 2D Transistor Engineer Intern
US, Oregon, Hillsboro
- Supply Chain Technical Analyst
Malaysia, Penang
- Quantum Computing Measurement Engineer
US, Oregon, Hillsboro
- Process Integration Development Engineer
US, Oregon, Hillsboro
- Memory Electrical Validation Engineer
India, Bangalore · US, Oregon, Hillsboro
- AutoTEM technician
US, Oregon, Hillsboro
- TD Memory Quality and Reliability Engineer
US, California, Folsom · US, California, Santa Clara · US, Oregon, Hillsboro
- Software Application Development Engineer
India, Bangalore · PRC, Chengdu · US, Arizona, Phoenix +1 more
- Haifa Lab technician - Student
Israel, Haifa
- Security Researcher Technical Lead
Israel, Haifa
- WATD Module Development Engineer
US, Oregon, Hillsboro
- Senior CPU Architecture and Benchmarking Engineer
US, Oregon, Hillsboro
- SoC Analog & Mixed-Signal Design Engineer
US, Oregon, Hillsboro
- Senior CPU Silicon Analysis Engineer
US, Oregon, Hillsboro
- Ocotillo Technology Fabrication Yield Defect Metrology Shift Group Leader
US, Arizona, Phoenix
- Advanced Packaging Process Engineer
US, Arizona, Phoenix
- GPU & AI Accelerator Hardware Design Undergraduate Intern
Canada, Toronto
- Thermal Mechanical Engineering Undergraduate Intern, GPU Platforms
Canada, Toronto
- AI Software Development Engineer - Neuromorphic Computing
US, California, Santa Clara
- APTM Central Senior Finance Analyst
US, Arizona, Phoenix · US, Oregon, Hillsboro · US, California, Folsom +1 more
- LTD Product Development Engineer
US, Oregon, Hillsboro
- Office Manager (Contract)
US, Washington, D.C.
- LTD Advanced Device Development Engineer
US, Oregon, Hillsboro
Where intel posts its jobs.
- Workday: 100 of the 100 roles listed here. How Litos fills Workday applications
Litos reads these roles from intel.wd1.myworkdayjobs.com/external.
Visa sponsorship record.
intel has H-1B filings on record with the US government: approved H-1B petitions in the USCIS H-1B Employer Data Hub (FY2021 to FY2023), and labor condition applications the Department of Labor certified (FY2025). A filing record is evidence the company has sponsored before, not a promise to sponsor you for a particular role.
New in the last 30 days.
Litos first saw 100 of the 100 roles listed here in the last 30 days.
- Partner Marketing Manager
Virtual US
- (Epi) - Module Development Engineer - (PhD Intern)
US, Oregon, Hillsboro
- CPU Clock Design Engineer
US, Texas, Austin · US, Oregon, Hillsboro
- Senior Manager, Branded Sponsorships
US, Oregon, Hillsboro · US, California, Folsom · US, California, Santa Clara +1 more
- Senior Ethernet Product Manager
US, Oregon, Hillsboro · US, California, Santa Clara · US, Arizona, Phoenix
- Senior Materials Commodity Manager
US, Oregon, Hillsboro · US, Arizona, Phoenix
- Senior Wet Etch Manufacturing Development Engineer
US, Oregon, Hillsboro · US, Arizona, Phoenix
- Senior AI Systems and Solutions Architect – Agentic AI and CPU Host
US, Oregon, Hillsboro · US, California, Folsom · US, California, Santa Clara +1 more
- Product Failure Analysis Engineer - SCAN Design for Test
US, Oregon, Hillsboro
- Intel Foundry Principal Engineer Overlay Development Engineer - Lithography
US, Oregon, Hillsboro
Questions.
How many jobs is intel hiring for?
518 open roles (629 postings counting each office separately), read from intel's own job board. The count refreshes every day.
What ATS does intel use?
intel posts its jobs on Workday: that is the system Litos reads its open roles from.
Does intel have internships open?
Yes. 16 of the 100 roles listed here are internships, by the posting's own job type or title.
Does intel sponsor H-1B visas?
intel has H-1B filings on record with the US government: approved H-1B petitions in the USCIS H-1B Employer Data Hub (FY2021 to FY2023), and labor condition applications the Department of Labor certified (FY2025). A filing record is evidence the company has sponsored before, not a promise to sponsor you for a particular role.